繁體中文 English

  • Mempax - 6-4
Mempax

Product Name: MEMpax®

MEMpax® is a borosilicate glass type which is produced by the down-draw method, enabling production in a very thin thickness range between 70 µm to 125 µm. The special composition of this substrate glass with fire-polished surfaces makes it suitable for a variety of applications: • MEMS (Micro-Electro-Mechanical Systems) • Optical and electrical Sensors • Slides and Micro-Arrays • Wafer Level Packaging • Microoptics on wafer level • Suited for anodic bonding with silicon wafer This glass meets the latest environmental requirements of our customers. MEMpax® can be supplied as glass wafer too. For this application we offer a separate wafer specification.

At the same time, MEMpax® is available in much lower thicknesses and offers a thin wafer that no longer needs to be ground and polished thanks to its excellent surface quality. SCHOTT MEMpax® can be used anywhere that extremely thin borosilicate glasses are needed.

Advantages

  • Microelectromechanical systems (MEMS)
  • Coefficient of linear thermal expansion corresponds with that of silicon
  • Suited for anodic bonding
  • Thin borosilicate glass wafers without polishing
  • High thermal and chemical resistance

Biotechnology

High transmission
Available in various thicknesses
Excellent surface quality
Low autofluorescence

Formats


(1) Length x Width, other formats upon request
(2) in reference of the longest edge length of the sheet


* Other thicknesses available upon request.

Enquiry Now
Products List